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Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits

    Buy cheap Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits from wholesalers
     
    Buy cheap Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits from wholesalers
    • Buy cheap Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits from wholesalers

    Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits

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    Brand Name : Integrated Silicon Solution
    Model Number : IS42S16160G-7TLI
    Certification : Original Part
    Price : to be Negotiated
    Payment Terms : T/T, Western Union, Paypal, Wechat Pay
    Supply Ability : 1 Million pieces per Month
    Delivery Time : Immediate
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    Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits

    Electronic Components DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II IS42S16160G-7TLI Integrated Circuits



    Options :

    • Package :

    54-pin TSOP-II.

    54-ball BGA.


    • Operating Temperature Range :

    Commercial (0oC to +70oC).

    Industrial (-40oC to +85oC).

    Automotive Grade A1 (-40oC to +85oC).

    Automotive Grade A2 (-40oC to +105oC).


    Features :


    • Clock frequency: 200,166, 143 MHz.

    • Fully synchronous; all signals referenced to a positive clock edge.

    • Internal bank for hiding row access/precharge.

    • Single Power supply: 3.3V + 0.3V.

    • LVTTL interface.

    • Programmable burst length.

    • Programmable burst sequence:Sequential/Interleave.

    • Auto Refresh (CBR).

    • Self Refresh.

    • 8K refresh cycles every 32 ms (A2 grade) or 64 ms (commercial, industrial, A1 grade).

    • Random column address every clock cycle.

    • Programmable CAS latency (2, 3 clocks).

    • Burst read/write and burst read/single write operations capability.

    • Burst termination by burst stop and precharge command.



    Technical Specifications :


    PCB changed54
    Package Length22.42(Max)
    Package Width10.29(Max)
    Package Height1.05(Max)
    MountingSurface Mount
    DRAM TypeSDRAM
    Chip Density (bit)256M
    Organization16Mx16
    Number of Internal Banks4
    Number of Words per Bank4M
    Number of Bits/Word (bit)16
    Data Bus Width (bit)16
    Maximum Clock Rate (MHz)143
    Maximum Access Time (ns)5.4
    Address Bus Width (bit)15
    Process TechnologyCMOS
    Interface TypeLVTTL
    Minimum Operating Supply Voltage (V)3
    Typical Operating Supply Voltage (V)3.3
    Maximum Operating Supply Voltage (V)3.6
    Operating Current (mA)130
    Minimum Operating Temperature (°C)-40
    Maximum Operating Temperature (°C)85
    Supplier Temperature GradeIndustrial
    Number of I/O Lines (bit)16
    PackagingTape and Reel
    Pin Count54
    Standard Package NameSOP
    Supplier PackageTSOP-II


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